STMP15x-SOM

Hardware revision changes:

--- hardware revision D1 ---

1. R62 changed from 10k to 100k/0402. This delays 3.3V going to the pull-up resistors of the I2C. 
This fixes power up hangs of some boards but increases the time needed between power ups for discharging. 
There should be at least 2 or 3 seconds between power down and power up.

--- hardware revision D ---

1. Revision identifier changed to Rev_D and year to 2022;
2. DBG1 hanged from NA(HN1x3) to HR1x3;
3. The SMD boot jumpers: BOOT0_VDD1, BOOT1_VDD1 and BOOT2_VDD1 were deleted. 
R18(2.2k/0402) and R19(2.2k/0402) were deleted too. Instead added the BOOT switch: BOOT_SW1(DSHP04TS-S)
and R17 changed from 2.2k/R0402 to 330R/R0402;
4. Test pads for all power supplies added;
5. R18(10k/R0402) added to the AXP209's IRQ pin;
6. Added R19(0R/R0402) between AXP209's PWROK and MCU's NRST pin;
7. C32 moved 30mils far away from the SD-Card. R22 moved 70mils to the same direction. R21 moved too;
9. Added CE mark was added;
10. Layers numeration added;
11. U1 changed from STM32MP157CAA3x to STM32MP15x.